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Nikon DSP-110 digital lithography system (announced 2026)

Nikon announced the DSP-110 digital lithography system on 13 October 2026 for semiconductor advanced packaging. It is scheduled for release in April 2027, with 1.5 µm line/space resolution and 72 panels/hour throughput on 510 × 515 mm substrates. India pricing and availability are unconfirmed.

Current listed pricePrice pending verificationSemiconductor advanced-packaging lithography system; 1.5 µm line/space resolution; optical-system upgrade can enable 1.0 µm line/space resolution.

announced; not yet available

Best forSemiconductor manufacturers evaluating high-density redistribution-layer patterning and advanced-package substrate lithography; industrial procurement requires direct Nikon sales consultation.
Verified: 2026-10-16

AT A GLANCE

Key specifications

SpecificationDigital lithography system for advanced semiconductor packaging; 1.5 micrometre line-and-space resolution; 72 panels/hour on 510 x 515 mm substrates; scheduled release April 2027.

BUYER VERDICT

BuyPicker verdict

Officially announced industrial lithography equipment, scheduled for April 2027; not a currently available consumer product.

TRADE-OFFS

Pros and cons

Pros

  • Officially announced specifications; higher throughput than DSP-100 according to Nikon; supports large substrates; optical-system upgrade path to 1.0 µm resolution.

Cons

  • Not scheduled for release until April 2027; price and India availability are unconfirmed; throughput and productivity claims are manufacturer-provided and have not been independently tested.

DETAILED REVIEW

What buyers should know

Official announcement

Nikon announced the DSP-110 digital lithography system on 13 October 2026. Commercial release is scheduled for April 2027; it is not yet available for purchase. No official public price or India availability was specified in the announcement.

Key specifications

1.5 µm line/space resolution, i-line-equivalent light source, overlay accuracy of ≤ ±0.3 µm and throughput of 72 panels per hour for 510 × 515 mm substrates. Supports square substrates including 310 × 310 mm, 510 × 515 mm, 600 × 600 mm and 730 × 920 mm, as well as 300 mm wafers. Nikon reports approximately 40% higher throughput than the DSP-100, and an optional optical-system upgrade to 1.0 µm resolution.

Pros and cons

Pros: photomask-free digital patterning; high throughput; large substrate support; upgrade path. Cons: availability scheduled for 2027; price undisclosed; industrial installation and support requirements not yet documented for India.

BuyPicker verdict

Relevant to advanced semiconductor-packaging manufacturers evaluating high-throughput, maskless lithography. Compare cost of ownership, process requirements and vendor support before procurement; manufacturer claims are not independent test results.

Official source: Nikon press release, 13 October 2026. Verification date: 15 October 2026. Quality status: Draft pending official image, pricing/market confirmation, structured fields and editorial review.

SOURCE TRANSPARENCY

Research & verification

Verificationverified
Freshnessfresh
Last verified2026-10-16
Primary sourceOpen source ↗

Checked against official manufacturer announcement on 2026-10-16. Specifications/announcement verified; price and local availability not independently confirmed.

Prices, availability and seller terms can change after verification. Check final terms before purchase. Affiliate disclosure.